Explore, Watch and be Inspired
Eastman Innovation Lab (EIL) is playing a key role in the 2015 IDSA International Conference. "EIL is proud to be a long-standing supporter of IDSA and its annual events," says Farrell Calabrese, IDSA, creative manager, EIL. "Dedicated to advancing innovation through design and education, EIL celebrates Future of the Future by being the design community's go-to material resource. Our goal is to help designers consider materials not as obstacles to overcome but as frontiers to be explored."
EIL is sponsoring the Education Symposium from 9am-5pm on August 19, 2015—packed with insights from some of the world’s leading higher education institutions and including a luncheon for educators at which the 2015 IDSA Student Merit Award (SMA) winners will be honored. A generous donation by EIL to IDSA’s charitable arm, the Design Foundation, is making it possible for IDSA to honor the five winners—representing IDSA’s District Design Conferences (DDCs)—with $1,000 each. The checks will be awarded to the students by IDSA Executive Director Daniel Martinage, CAE, and Bryan Shackelford, IDSA, material design representative, EIL.
Also, Eastman Innovation Lab has become the first sponsor of the Design Foundation Auction. This year’s auction will launch onsite in the IDSA Experience at the International Conference, followed by an online portion after the conference wraps up.
"EIL is dedicated to advancing innovation through design and education," says Shackelford. "Rooted in Eastman's long history of supporting higher education, EIL is proud to work with the IDSA Foundation to provide scholarships for SMA winners, our next generation of industrial designers, who will continue to advocate for the profession through education and community." He adds, EIL hopes this contribution will extend an excitement around education in materials and processes, providing students a foundation that will be the basis of their future success.
Thursday, August 20, Eastman Innovation Lab will host an invitation-only breakfast at the International Conference.